ARM teams up with Glofo at MWC - again -

GlobalFoundries and ARM are using Mobile World Congress (MWC) in Barcelona as a platform to announce new System-on-Chip (SoC) platform technology to power next gen wireless products boasting 40 percent increases in computing performance and 30 per cent improvements in power efficiency.

Word on the Catalonian street is that the new chip manufacturing platform will also sport 100 per cent increase in standby battery life – which translates to about 10 to 15 hours for the average smartphone.

The British Fish n’ Chippy will be working with Glofo on two variants of the new platform including 28nm super low power (SLP) for mobile and consumer applications and 28nm high performance (HP) for applications that need “maximum performance.”

The platform will of course be based on ARM’s very own Cortex- A9 processor, along with a healthy dose of the firm’s optimised physical IP, combined with Glofo’s 28nm Gate-First High-K Metal Gate (HKMG) process. 

ARM is banking on the fact that the partnership should help it push even further into the embedded space and secure a plethora of design wins with manufacturers of embedded devices like smartphones, smartbooks and tablets.

To add to its value proposition, ARM reckons the partnership addresses “increasing design and manufacturing complexities while reducing time to volume production at mature yields.” 

Glofo says it expects to start production on the platform in the second half of 2010 at its Fab 1 in Dresden, Germany.

The fab Fab also expects to come up with “significant performance gains” over the previous generation 40/45nm technologies, meaning higher performance within the same thermal envelope. Practically, this means better application performance and increased multi-tasking capabilities on mobile devices.

 It should also mean longer talk time, more multimedia playback time and even some half decent gaming and graphics before your battery dies.

ARM isn’t putting all its eggs in the Glofo basket, however. The firm has also established what it deems “strategic relationships” with other members of the IBM Joint Development Alliance to push ahead with the development of processors and physical IP tuned to the HKMG process. 

And to prove it isn’t bluffing, ARM will be showing off its first 28nm wafer with HKMG technology at Mobile World Congress this week.

Stay tuned for pictures.